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| (R) STPS41H100CG/CT/CR LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCTS CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 2 x 20 A 100 V 175 C 0.67 V A1 K A2 FEATURES AND BENEFITS NEGLIGIBLE SWITCHING LOSSES LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED s s s s s A2 A1 K A1 K A2 I2PAK STPS41H100CR K TO-220AB STPS41H100CT DESCRIPTION Dual center tab Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in D2PAK, I2PAK and TO-220AB, this device is intended for use in high frequency inverters. ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt *: Parameter Repetitive peak reverse voltage RMS forward current Average forward current Tc = 150C = 0.5 A2 A1 D2PAK STPS41H100CG Value 100 30 Per diode Per device 20 40 220 1 18100 - 65 to + 175 175 10000 Unit V A A A A W C C V/s Surge non repetitive forward current Peak repetitive reverse current Repetitive peak avalanche power Storage temperature range tp = 10 ms sinusoidal tp=2 s square F=1kHz tp = 1s Tj = 25C Maximum operating junction temperature * Critical rate of rise reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/6 July 2003 - Ed : 3A STPS41H100CG/CT/CR THERMAL RESISTANCES Symbol Rth(j-c) Rth(c) Junction to case Coupling Parameter Per diode Total Value 1.5 0.8 0.1 Unit C/W When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * Parameter Reverse leakage current Tests Conditions Tj = 25C Tj = 125C VF * Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% Min. Typ. Max. 10 Unit A mA V VR = VRRM 3 IF = 20 A IF = 20 A IF = 40 A IF = 40 A 0.70 0.62 10 0.80 0.67 0.90 0.76 To evaluate the conduction losses use the following equation : P = 0.58 x IF(AV) + 0.0045 IF2(RMS) Fig. 1: Conduction losses versus average current. PF(av)(W) 16 14 12 = 0.1 = 0.2 =1 = 0.5 Fig. 2: Average forward current versus ambient temperature ( = 0.5). IF(av)(A) 22 Rth(j-a)=Rth(j-c) 20 18 16 14 10 8 = 0.05 12 10 6 4 2 T 8 6 4 T Rth(j-a)=50C/W IF(av)(A) 0 0 5 10 15 =tp/T 20 2 tp 0 =tp/T tp Tamb(C) 50 75 100 125 150 175 25 0 25 2/6 STPS41H100CG/CT/CR Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 300 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.9 250 0.8 0.7 Tc=25C 200 0.6 0.5 = 0.5 150 Tc=75C 0.4 100 IM t Tc=125C = 0.2 = 0.1 0.3 0.2 T Single pulse 50 =0.5 t(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 0 1.E-03 =tp/T tp 1.E+00 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) 1.E+02 Tj=150C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 10.0 F=1MHz Vosc=30mV Tj=25C 1.E+01 Tj=125C 1.E+00 Tj=100C 1.E-01 Tj=75C 1.0 1.E-02 Tj=50C 1.E-03 Tj=25C VR(V) 1.E-04 0 10 20 30 40 50 60 70 80 90 100 0.1 1 VR(V) 10 100 3/6 STPS41H100CG/CT/CR Fig. 9: Forward voltage drop versus forward current. Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35m).(STPS41H100CG only) Rth(j-a)(C/W) 80 70 60 50 IFM(A) 100 Tj=125C (Maximum values) 10 Tj=125C (Typical values) 40 Tj=25C (Maximum values) 30 20 10 0 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 S(cm) 0 5 10 15 20 25 30 35 40 PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. A E L2 Millimeters Min. Max. 4.60 2.69 0.93 1.17 1.17 0.60 1.36 9.35 2.70 10.4 13.6 3.78 1.40 4.40 2.49 0.70 1.14 1.14 0.45 1.23 8.95 2.40 10.0 13.1 3.48 1.27 Inches Min. 0.173 0.098 0.028 0.044 0.044 0.018 0.048 0.352 0.094 0.394 0.516 0.137 0.050 Max. 0.181 0.106 0.037 0.046 0.046 0.024 0.054 0.368 0.106 0.409 0.535 0.149 0.055 A c2 A1 b b1 D b2 c c2 A1 L1 b2 L b1 b e D e E L c L1 L2 4/6 STPS41H100CG/CT/CR PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E L2 C2 Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 A A1 D A2 B B2 C L L3 A1 B2 B G A2 C R C2 D E G L L2 M * V2 L3 M * FLAT ZONE NO LESS THAN 2mm FOOTPRINT (dimensions in mm) 16.90 10.30 1.30 5.08 3.70 8.90 5/6 STPS41H100CG/CT/CR PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS REF. H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A Millimeters Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 1.14 1.70 4.95 5.15 2.40 2.70 10 10.40 16.4 typ. 13 14 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Inches Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. Ordering type STPS41H100CT STPS41H100CG Marking STPS41H100CT STPS41H100CG STPS41H100CR Package TO-220AB D PAK D PAK I PAK 2 2 2 Weight 2.20 g 1.48 g 1.48 g 1.49 g Base qty 50 50 1000 50 Delivery mode Tube Tube Tape & reel Tube STPS41H100CG-TR STPS41H100CG STPS41H100CR s EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 6/6 |
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